Here you will find news and new product highlights from our company, as well as dates for trade fairs and events.
Leutz Lötsysteme and Emil Otto further cooperate in well-engineered product and process solutions for your optimized soldering process on the way to „zero-defect“ and reliable electronics. Highest accuracy of the devices, material compatibility, suitable efficient cleaning media and innovative flux solutions perfectly matched – join connection!
Visit us at our booth at SMT connect,
Hall 4 Booth 128, 7th to 9th May 2019 in Nuremberg.
As a process-accompanying equipment manufacturer, we work for our customers on the realization of the Smart Factory. With our latest developments, we enable the fixing and processing of various PCB shapes and types.
We are looking forward to your visit!
SMT Hybrid Packaging is the international rendezvous for providers of SMT equipment, components and services for use in the manufacturing of electronic equipment.
We will be exhibiting again this year and look forward to your visit.
You will find us on stand 128 in Hall 4.
Visit us from 16 - 18 May 2017 at SMT Hybrid Packaging in Nuremberg. Hall 4 - Stand 128.
We look forward to your visit!